1.specially for the wafer(sheet),glass,substrate,cutting film process,equipped with precision guide,temperature control system,so that the overrall performance of the machines is stable,fast and convenient operation.
2.for the blue film,UV film, PET film and other substrate of single/double membrance.
1.the temperature at room temperature - 100.
2.the wafer placement platform adopts the floating design,and the height is adjustable, so it can be compatible with a wider range of thickness of the wafer, and the floating design can better protect the wafer, and the working disk with heating function.
3.wafer positioning marking.
4.from the layer of automatic winding recyling, suitable for the protection of the double layer film, and the recovery of adjustable.
5. the membrance material and put the film between the lock cylinder without any tools.
6.no bubble fast film.
7.anti electrostatic plate processing Teflon can effectively protect the chip.
8.ironing roller pressure can be adjusted by adjusting the air pressure.
9.equipped with a circular knife and cross cutting knife,blade life.