Optical Alignment ACHI HR15000 Mobile Phone BGA Rework Station

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  • 1-2 Sets
    US $3800.00
  • >=3 Sets
    US $3600.00
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Overview
Quick Details
Type:
Other
Place of Origin:
Guangdong, China (Mainland)
Brand Name:
ACHI
Model Number:
Optical Alignment ACHI HR15000 Mobile Phone BGA Rework Station
Voltage:
220±10%VAC
Current:
50/60Hz
Rated Capacity:
5300W
Rated Duty Cycle:
65%
Dimensions:
640x630x900mm
Weight:
68kg
Usage:
optical alignment bga rework station for laptop,game console repair
Certification:
CE
After-sales Service Provided:
Engineers available to service machinery overseas
Total power:
5300W Max.
PCB size:
Max. 410x370mm Min.65x65mm
BGA Chip Size:
Max.80*80mm / Min 2*2 mm
Size of buttom heater:
360*240mm
Inner Control Structure:
Touch screen software + PLC+heating plate
Operation interface:
touch screen (MCGS)
Warranty:
one year
Temperature control:
K-type thermcouple
External temperature sensor:
three
Machine dimension:
640x630x900mm

 

Optical Alignment ACHI HR15000 Mobile Phone BGA Rework Station

 

Product Description

High lights of this Optical Alignment ACHI HR15000 Mobile Phone BGA Rework Station

1. Latest New Optical Alignment System, easy to operate, success rate can be 100%.

2. With laser position.

3. Automatic identify BGA chips and mounting height.

4. Top heater device and mounting head 2 in 1 design.

5. Semi amtomatic soldering and desoldering.

6. CCD System and Optical Alignment System combined, can change the screen by one button.

7. Automatic adjust chromatism resolution and brightness.

8. With laser position.

9. With Micrometer to do Micro adjust.

10. With a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation.

11. With 3 temprature zones and 3 external temp sensor sockets.

 

Specifications of this Optical Alignment ACHI HR15000 Mobile Phone BGA Rework Station

Power voltage220V±10% VAC   50/60Hz
Total power5300W Max.
Top hot-air heater1200W
Bottom hot-air heater1200W
Bottom IR heater2700W
Size of buttom heater360*240mm
PCB SizeMax.500*400mm / Min.22*22mm
BGA Chip SizeMax.80*80mm / Min 2*2 mm
PositioningV-type groove, with universal fixture
Temperature controlK-type thermocouple (Closed Loop) ±2
Max.amplification230X
Surface mounting accuracy within ±0.01mm
CCD and optical systemZoom in And out,beam spilt, micro-asjust,Antomatic adjust chiromatism resolution and brightness
Machine dimension640x630x900mm
New Weight

68 KG

Packing weight

110kg

 

Main Struction of this ACHI HR15000 BGA System Mobile Repair Soldering Station

 

More details of this Optical Alignment ACHI HR15000 Mobile Phone BGA Rework Station

 

1. When desoldering

 

2. When soldering

2.1 Pick the Chips with vacuum pen

 

2.2 Laser position

 

2.3 Optical Alignmnet

 

 

2.4 Micro adjust with micrometer


 

Function buttons of this Optical Alignment ACHI HR15000 Mobile Phone BGA Rework Station

 

 

 

FAQ

1. Packing

Packaging material: Wooden with foam inside.
Packaging size and weight: 74*74*103cm / 110KG

2. Shipping

3-8 workdays shipping from China by Air/Express(DHL,FedEx,UPS,EMS etc.)

We can arrange shipment by sea. Minium CBM requirement : 1 CBM

3. Warranty

1 year free for spare parts, 2-3 years cost price and free technical support always.

4. MOQ

1 set machine, mixed orders are also welcomed.

5. User Manual

We provide you with a friendly English user manual for free.

6. Videos

Videos of operating the machine are available.

Assistant videos are also provided in after-sale service.

 

 

Demonstration and Customer Experience

 

Company Information